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          Reliability Data

          Mean Time Between Failure (MTBF)

          Because operating temperature is one of the most important factors in determining overall module reliability, it is imperative that the user's system design allow for efficient heat transfer from the baseplate to system ambient. Since temperature and failure rate are exponentially related, just a 10°C decrease in baseplate temperature can have a dramatic increase in MTBF. Due to patented zero-voltage/zero-current switching topology, Vicor converters are highly efficient compared to those with more traditional topologies. High efficiency translates into both smaller size and lower temperature rises. To minimize thermal impedance, all major power dissipating components are mounted directly to the baseplate.

          Below are representative calculated MTBF values based on MIL-HDBK-217F. If you require information about a specific model, contact Vicor with the model number, expected baseplate temperature, and operating environment to obtain an individually prepared report.

          MTBF in 1000 Hours

          Part Number Baseplate Temperature G.B. G.F. A.I.C. N.S.
          MI-J71-MY 25°C 3,782 1,891 1,135 1,116
          50°C 2,307 1,154 692 681
          65°C 1,778 889 533 524
          MI-274-MW 25°C 3,830 1,878 1,149 1,130
          50°C 2,336 1,915 701 689
          65°C 1,800 900 540 531
          V24C3V3M75BL
          Micro Module
          25°C 6,235 3,117 1,870 1,839
          50°C 3,803 1,902 1,141 1,122
          65°C 2,930 1,465 879 864
          V24B5M200BL
          Mini Module
          25°C 4,205 2,102 1,201 1,240
          50°C 2,565 1,282 769 757
          65°C 1,976 988 593 583
          V24A12M400BL
          Maxi Module
          25°C 3,428 1,714 1,028 845
          50°C 2,091 1,282 627 617
          65°C 1,611 806 483 475

          Environmental Qualification

          Fully encapsulated, Vicor Maxi, Mini, Micro, and MI family modules utilize a proprietary spin fill process that assures complete, void free encapsulation making them suitable for the harshest environments. In addition to providing mechanical rigidity, the encapsulant is thermally conductive to eliminate hot spots and aid in heat transfer to the baseplate. Modules are available with temperatures down to -55°C operating and -65°C storage.

          To verify the suitability of Vicor's H & M-Grade Maxi, Mini, and Micro as well as MI Family modules for harsh environments, these products have been subjected to the environmental testing requirements of MIL-STD-810, MIL-S-901 and MIL-STD-202. These tests, listed below, are performed at an independent laboratory. Additional environmental tests can be done upon individual customer request.

          Environment
          MI Family Module
          Maxi, Mini & Micro Module

          Altitude

          • MIL-STD-810F
            Method 500.4
            Procedure I & II
            40,000 ft.and 70,000 ft. Operational
          • MIL-STD-810D
            Method 500.2
            Procedure III
            explosive decompression (40 K ft.)
          • MIL-STD-810D
            Method 500.2
            Procedure II
            40,000 ft.
            1000 – 1500 ft./min. to
            70,000 ft., unit functioning

          Explosive Atmosphere

          • MIL-STD-810F
            Method 511.4
            Procedure I
            Operational
          • MIL-STD-810C
            Method 511.1
            Procedure I

          Vibration

          • MIL-STD-810F
            Method 514.5
            Procedure I
            category 14
            sine and random vibration
            per Table 514.5C
            for helicopter AH-6J main rotor
            with overall level of 5.6 g rms
            for 4 hours per axis
          • MIL-STD-810F
            Method 514.5C
            general minimum
            integrity curve
            per Figure 514.5C-17
            with overall level of 7.7 g rms
            for 1 hr per axis
          • MIL-STD-810D
            Method 514.3
            Procedure I
            category 6
            helicopter, 20 g
          • MIL-STD-810D
            Method 514.3
            random:
            10 – 300 Hz @ 0.02 g2/Hz
            2000 Hz @ 0.002 g2/Hz
            3.9 total g rms
            3 hrs/axis
            sine:
            30 Hz @ 20 g
            60 Hz @ 10 g
            90 Hz @ 6.6 g
            120 Hz @ 5.0 g
            16.0 total g rms
            3 axes
          • MIL-STD-810E
            Method 514.4
            Table 514.4-VII
            ±6 db/octave 7.7 g rms
            1hr/axis

          Shock

          • MIL-STD-810F
            Method 516.5
            Procedure I
            functional shock, 40 g
          • MIL-S-901D
            lightweight hammer shock
            3 impacts/axis,1, 3, 5 ft.
          • MIL-STD-202F
            Method 213B
            60 g, 9 ms half sine
          • MIL-STD-202F
            Method 213B
            75 g, 11 ms saw tooth shock
          • MIL-STD-810D
            Method 516.3
            Procedure I
            functional shock, 40 g
          • MIL-STD-202F
            Method 213B
            18 pulses, 60 g, 9 msec
          • MIL-STD-202F
            Method 213B
            75 g, 11 ms saw tooth shock
          • MIL-STD-202F
            Method 207A
            3 impacts / axis, 1, 3, 5 feet

          Acceleration

          • MIL-STD-810F
            Method 513.5
            Procedure II
            Table 513.5-II
            Operational
            2 – 7 g
            6 directions
          • MIL-STD-810D
            Method 513.3
            Procedure II
            Operational test
            9 g for 1 minute
            along 3 mutually
            perpendicular axes

          Humidity

          • MIL-STD-810F
            Method 507.4
            95% Relative Humidity
          • MIL-STD-810F
            Method 507.4
            95% Relative Humidity

          Solder Test

          • MIL-STD-202G
            Method 208H
            8 hr aging
          • MIL-STD-202G
            Method 208H
            8 hr aging

          Fungus

          • MIL-STD-810F
            Method 508.5
          • MIL-STD-810C
            Method 508.1

          Salt Fog

          • MIL-STD-810F
            Method 509.4
          • MIL-STD-810C
            Method 509.1

          Contact Form

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